2227MC-18-03-08-F1

MULTICOMP PRO - 2227MC-18-03-08-F1 - IC- & Baustein-Sockel, 18 Kontakt(e), DIP-Sockel, 2.54 mm, 2227MC, 7.62 mm, Berylliumkupfer

Lifecycle: Active Supply Risk Score and Supply Risk Trend are available on Pro and Enterprise. Watchlist (Pro)

Country of origin: TWRoHS Compliant

Farnell

Supply Risk Summary

Supply chain risk trend is available on Pro and Enterprise plans.

Single source

Active

Confirmed Stock

7,729

Single source

Best Unit Price

—

Availability

1of 1 suppliers

Fastest delivery: 161 days

Supplier	Supplier Part Number	Stock	Delivery	Factory Lead	MOQ	Packaging	Status
Farnell	1103847	7,729	161 days	—	Minimum order quantity 5	—	In Stock

Supplier	Description	RoHS	Life Cycle	SVHC	Country	Tariff Code	Links
Farnell 1103847	MULTICOMP PRO - 2227MC-18-03-08-F1 - IC- & Baustein-Sockel, 18 Kontakt(e), DIP-Sockel, 2.54 mm, 2227MC, 7.62 mm, Berylliumkupfer	Yes	Active	Lead (04-Feb-2026)	TW	85366930 (EU CN)

Farnell

Anzahl der Kontakte18Kontakt(e)

euEccnNLR

hazardousfalse

isCanonicalY

KontaktmaterialBerylliumkupfer

KontaktüberzugVergoldete Kontakte

productTraceabilityNo

Produktpalette2227MC

Rastermaß2.54mm

Reihenabstand7.62mm

rohsPhthalatesCompliantYES

SteckverbinderDIP-Sockel

usEccnEAR99