32Gbit 1.06V~1.17V 2.133GHz LPDDR4X SDRAM TFBGA-200(10x14.5) Memory (ICs) RoHS
Lifecycle: Active Supply Risk Score and Supply Risk Trend are available on Pro and Enterprise. Watchlist (Pro)
Datasheets:Datasheet (Farnell)
Country of origin: TWRoHS Compliant MSL MSL 3
Farnell
Supply Risk Summary
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View PlansConfirmed Stock
1,333
Single source
Best Unit Price
—
Availability
1of 5 suppliers
Shortest factory lead: 39 weeks
Stock by Supplier
Stock & Availability
| Supplier | Supplier Part Number | Stock | Delivery | Factory Lead | MOQ | Packaging | Status |
|---|---|---|---|---|---|---|---|
 | 1,333 | — | — | Minimum order quantity 1 | — | In Stock | |
 | 0 | — | 39 weeks | Minimum order quantity 1Order multiple 1,360 | Box | No Stock | |
 | 0 | 364 days | — | Minimum order quantity 1 | — | No Stock | |
 | 0 | — | — | Minimum order quantity 1Order multiple 1,360 | Tray | No Stock | |
 | 0 | — | — | Minimum order quantity 1,360 | — | No Stock |
Supplier Part Details
| Supplier | Description | RoHS | MSL | Life Cycle | SVHC | Category | Country | Weight | Tariff Code | Packaging | Links |
|---|---|---|---|---|---|---|---|---|---|---|---|
Digi-Key 557-MT53E1G32D2FW-046AAT:B-ND | SDRAM - Mobile LPDDR4X Memory IC 32Gbit Parallel 2.133 GHz 3.5 ns 200-TFBGA (10x14.5) | — | MSL 3 | Active | — | Integrated Circuits (ICs) | — | — | 8542.32.0036 (US HTS) | Box | |
Winsource MT53E1G32D2FW-046 AAT:B | LPDDR4-4266 1Gx32 (32Gb) | Yes | — | — | — | — | — | — | — | — | |
Farnell 3880972 | MICRON - MT53E1G32D2FW-046 AAT:B - DRAM, Mobile LPDDR4, 32 Gbit, 1G x 32 Bit, 2.133 GHz, TFBGA, 200 Pin(s) | Yes | — | Active | No SVHC (17-Dec-2015) | — | TW | — | 85423239 (EU CN) | — | |
LCSC C5128623 | 32Gbit 1.06V~1.17V 2.133GHz LPDDR4X SDRAM TFBGA-200(10x14.5) Memory (ICs) RoHS | Yes | — | — | — | DDR SDRAM | — | 0.00025 g | — | Tray | |
TME MT53E1G32D2FW046AA | IC: DRAM Speicher; 32GbDRAM; 2,133GHz; -40÷105°C; 1,1÷1,17V | — | — | New | — | DRAM Speicher - Integrierte Schaltungen | — | — | — | — |
Technical Attributes
Anzahl der Pins200Pin(s)
Betriebstemperatur, max.105°C
Betriebstemperatur, min.-40°C
DRAM-AusführungMobile LPDDR4
euEccnNLR
hazardousfalse
IC-Gehäuse / BauformTFBGA
IC-MontageOberflächenmontage
isCanonicalY
MSLMSL 3 - 168 Stunden
productTraceabilityYes-Date/Lot Code
Produktpalette-
rohsPhthalatesCompliantYES
Speicherdichte32Gbit
Speicherkonfiguration1G x 32 Bit
Taktfrequenz, max.2.133GHz
usEccnEAR99
Versorgungsspannung, nom.1.1V