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JST / JAPAN SOLDERLESS TERMINALS - BM08B-XASS-TF (LF)(SN) - Stiftleiste, Wire-to-Board, 2.5 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, XA Series

Lifecycle: Active Supply Risk Score and Supply Risk Trend are available on Pro and Enterprise. Watchlist (Pro)
Country of origin: JPRoHS Compliant

Supply Risk Summary

Supply chain risk trend is available on Pro and Enterprise plans.
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Confirmed Stock
350
Single source
Best Unit Price
—
Availability
1of 1 suppliers
Fastest delivery: 190 days

Stock by Supplier

Stock & Availability

Supplier Supplier Part Number Stock DeliveryFactory LeadMOQPackagingStatus
Farnell
Farnell
350190 days—
Minimum order quantity 10
—In Stock

Supplier Part Details

Supplier DescriptionRoHSLife CycleSVHCCountryTariff CodeLinks
Farnell
Farnell
5110272
JST / JAPAN SOLDERLESS TERMINALS - BM08B-XASS-TF (LF)(SN) - Stiftleiste, Wire-to-Board, 2.5 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, XA SeriesYesActiveNo SVHC (17-Dec-2015)JP85366930 (EU CN)

Technical Attributes

Farnell
Farnell
Anzahl der Kontakte8Kontakt(e)
Anzahl der Reihen1Reihe(n)
euEccnNLR
hazardousfalse
isCanonicalY
KontaktanschlussOberflächenmontage
KontaktmaterialKupferlegierung
KontaktüberzugVerzinnte Kontakte
Nennkontaktstrom3A
productTraceabilityNo
ProduktpaletteXA Series
Rastermaß2.5mm
rohsPhthalatesCompliantYES
SteckverbinderPCB-Stiftleiste
SteckverbinderausrichtungGerade
SteckverbinderkragenMit Kragen
SteckverbindermaterialGehäuse aus Nylon (Polyamid)
SteckverbindersystemeWire-to-Board
usEccnEAR99