JST / JAPAN SOLDERLESS TERMINALS - BM08B-XASS-TF (LF)(SN) - Stiftleiste, Wire-to-Board, 2.5 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, XA Series
Lifecycle: Active Supply Risk Score and Supply Risk Trend are available on Pro and Enterprise. Watchlist (Pro)
Datasheets:Datasheet (Farnell)
Country of origin: JPRoHS Compliant
Supply Risk Summary
Supply chain risk trend is available on Pro and Enterprise plans.
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View PlansConfirmed Stock
350
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Best Unit Price
—
Availability
1of 1 suppliers
Fastest delivery: 190 days
Stock by Supplier
Stock & Availability
| Supplier | Supplier Part Number | Stock | Delivery | Factory Lead | MOQ | Packaging | Status |
|---|---|---|---|---|---|---|---|
| 350 | 190 days | — | Minimum order quantity 10 | — | In Stock |
Supplier Part Details
Technical Attributes
Anzahl der Kontakte8Kontakt(e)
Anzahl der Reihen1Reihe(n)
euEccnNLR
hazardousfalse
isCanonicalY
KontaktanschlussOberflächenmontage
KontaktmaterialKupferlegierung
KontaktüberzugVerzinnte Kontakte
Nennkontaktstrom3A
productTraceabilityNo
ProduktpaletteXA Series
Rastermaß2.5mm
rohsPhthalatesCompliantYES
SteckverbinderPCB-Stiftleiste
SteckverbinderausrichtungGerade
SteckverbinderkragenMit Kragen
SteckverbindermaterialGehäuse aus Nylon (Polyamid)
SteckverbindersystemeWire-to-Board
usEccnEAR99