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by Multicomp Pro

MULTICOMP PRO - MC-254-06-00-ST-DIP - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 6 Kontakt(e), Durchsteckmontage

Lifecycle: Active Supply Risk Score and Supply Risk Trend are available on Pro and Enterprise. Watchlist (Pro)
Country of origin: TWRoHS Compliant
MC-254-06-00-ST-DIP
Farnell

Supply Risk Summary

Supply chain risk trend is available on Pro and Enterprise plans.
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Confirmed Stock
3,763
Single source
Best Unit Price
—
Availability
1of 1 suppliers
Fastest delivery: 205 days

Stock by Supplier

Stock & Availability

Supplier Supplier Part Number Stock DeliveryFactory LeadMOQPackagingStatus
Farnell
Farnell
3,763205 days—
Minimum order quantity 1
—In Stock

Supplier Part Details

Supplier DescriptionRoHSLife CycleSVHCCountryTariff CodeLinks
Farnell
Farnell
2843525
MULTICOMP PRO - MC-254-06-00-ST-DIP - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 6 Kontakt(e), DurchsteckmontageYesActiveNo SVHC (04-Feb-2026)TW85366930 (EU CN)

Technical Attributes

Farnell
Farnell
Anzahl der Kontakte6Kontakt(e)
Anzahl der Reihen2Reihe(n)
euEccnNLR
hazardousfalse
isCanonicalY
KontaktanschlussDurchsteckmontage
KontaktmaterialKupferlegierung
KontaktüberzugVergoldete Kontakte
productTraceabilityYes-Date/Lot Code
Produktpalette-
Rastermaß2.54mm
rohsPhthalatesCompliantYES
SteckverbinderPCB-Stiftleiste
SteckverbinderkragenMit Kragen
SteckverbindersystemeWire-to-Board
usEccnEAR99